View MPXH6300AC6T1_6495472.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

document number: mpxh6300a rev 5.1, 05/2012 ? 2007, 2010, 2012 freescale semi conductor, inc. all rights reserved. pressure freescale semiconductor data sheet: technical data h igh temperature accuracy integrated silicon pressure sensor for measuring absolute pressure, on-chip signal conditioned, temperature compensated and calibrated the freescale mpxh6300a series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor ne tworks to provide a high output signal and temperature compensation. the small form factor and high reliability of on-chip integration make the freescale pressure sensor a logical and economical choice for the system designer. the mpxh6300a series piezoresistive transducer is a state-of-the-art, monolithic, signal conditione d, silicon pressure sensor. this sensor combines advanced micromachining techniques, th in film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. features ? improved accuracy at high temperature ? available in super small outline packages ? 1.5% maximum error over 0 to 85 c ? ideally suited for mi croprocessor or microcontroller-based systems ? temperature compensated from ?40 to +125 c ? durable thermoplastic ( pps) surface mount package ordering information device name package options case no. # of ports pressure type device marking none single dual gauge differential absolute super small outline package (mpxh6300a series) mpxh6300a6u rail 1317 ? ? mpxh6300a mpxh6300a6t1 tape & reel 1317 ? ? mpxh6300a mpxh6300ac6u rail 1317a ? ? mpxh6300a MPXH6300AC6T1 tape & reel 1317a ? ? mpxh6300a mpxh6300a 20 to 304 kpa (3.0 to 42 psi) 0.3 to 4.9 v output series mpxh6300a6u/6t1 case 1317 mpxh6300ac6u/6t1 case 1317a super small ou tline packages application examples ? industrial controls ? engine control/manifold absolute pressure (map)
mpxh6300a sensors 2 freescale semiconductor, inc. pressure operating characteristics table 1. operating characteristics (v s = 5.1 vdc, t a = 25c unless otherwise noted, p1 > p2. characteristic symbol min typ max unit pressure range p op 20 ? 304 kpa supply voltage (1) 1. device is ratiometric within this specified excitation range. v s 4.74 5.1 5.46 vdc supply current i o ? 6.0 10 madc minimum pressure offset (0 to 85 c) @ v s = 5.1 volts (2) 2. offset (v off ) is defined as the output voltage at the minimum rated pressure. v off 0.241 0.306 0.371 vdc full scale output (0 to 85 c) @ v s = 5.1 volts (3) 3. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. v fso 4.847 4.912 4.977 vdc full scale span (0 to 85 c) @ v s = 5.1 volts (4) 4. full scale span (v fss ) is defined as the algebraic difference between the output volt age at full rated pressure and the output voltage at the minimum rated pressure. v fss 4.476 4.606 4.736 vdc accuracy (5) (0 to 85 c) 5. accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a perc ent of span at 25 c due to all sources of error including the following: linearity: output deviation from a straight line relations hip with pressure over the specified pressure range. temperature hysteresis: output deviation at any temperature with in the operating temperature range, after the temperature is cyc led to and from the minimum or maximum operating temperatur e points, with zero differential pressure applied. pressure hysteresis: output deviation at any pressure within the specified range, when this pressu re is cycled to and from the minimum or maximum rated pressure, at 25 c. tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. tcoffset: output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. variation from nominal: the variation fr om nominal values, for offset or fu ll scale span, as a percent of v fss , at 25 c. ??? 1.5 %v fss sensitivity v/p ? 16.2 ? mv/kpa response time (6) 6. response time is defined as the time for t he incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. t r ?1.0?ms warm-up time (7) 7. warm-up time is defined as the time r equired for the product to meet the specifi ed output voltage after the pressure has been stabilized. ??20?ms offset stability (8) 8. offset stability is the product's output deviation when subjected to 1000 hours of pu lsed pressure, temperature cycling with bias test. ?? 0.25 ? %v fss
mpxh6300a sensors freescale semiconductor, inc. 3 pressure maximum ratings figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. figure 1. fully integrated pressure sensor schematic table 2. maximum ratings (1) 1. exposure beyond the specified limits may c ause permanent damage or degradation to the device. rating symbol value units maximum pressure (p1 > p2) p max 1200 kpa storage temperature t stg -40 to +125 c operating temperature t a -40 to +125 c output source current @ full scale output (2) 2. maximum output current is controlled by effective impedance from v out to gnd or v out to v s in the application circuit. i o +0 . 5m a d c output sink current @ minimum pressure offset (2) i o -- 0 . 5m a d c pins 1, 5, 6, 7, and 8 are no connects sensing element v out v s gain stage #2 gnd and ground reference shift circuitry thin film temperature compensation and gain stage #1 4 2 3
mpxh6300a sensors 4 freescale semiconductor, inc. pressure on-chip temperature compensation and calibration figure 2 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 1317). figure 3 illustrates a typical application circuit (output source current operation). figure 4 shows the sensor output signal relative to pressure input. typical minimum and maximum output curves are shown for operation over 0 to 85 c temperature range. the output will saturate outside of the rated pressure range. a fluorosilicone gel isolates the die surface and wire bonds from the environment, while a llowing the pressure signal to be transmitted to the silicon diaphragm. the mpxh6300a series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. media other than dry air may have adverse effects on sensor performance and long-term reliability. contact the factory for information regarding media compatibility in your application. figure 2. cross sectional diagram ssop (not to scale) figure 3. typical application circuit (output source current operation) figure 4. output vs. absolute pressure wire bond stainless steel cap thermoplastic case die bond sealed vacuum reference fluoro silicone gel die coat lead frame absolute element p1 die v s pin 2 +5.1 v gnd pin 3 v out pin 4 mpxh6300a to adc 100 nf 51 k 47 pf output (volts) pressure (reference to sealed vacuum) in kpa 20 35 50 65 80 95 110 125 140 155 170 185 200 215 230 245 260 275 290 304 4.5 0 4.0 5.0 1.0 1.5 2.0 2.5 3.0 3.5 0.5 min max typ transfer function: v out = v s *(.00318*p-.00353) error v s = 5.1 vdc temperature = 0 to 85c
mpxh6300a sensors freescale semiconductor, inc. 5 pressure nominal transfer value: v out = v s x (0.00318 x p - 0.00353) (pressure error x temp factor x 0.00318 x v s ) v s = 5.1 0.36 vdc transfer function (mpxh6300a) temp multiplier -40 3 0 to 85 1 125 3 temperature in c 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 140120100 80 temperature error factor note: the temperature multiplier is a linear res ponse from 0c to -40c and from 85c to 125c. temperature error band pressure error (max) pressure error band 20 to 304 (kpa) 4.0 (kpa) mpxh6300a series pressure (in kpa) error limits for pressure break points pressure error (kpa) 3.0 2.0 1.0 -1.0 -2.0 -4.0 0.0 4.0 -3.0 20 60 100 140 180 220 260 300
mpxh6300a sensors 6 freescale semiconductor, inc. pressure minimum recommended footprint for super small packages surface mount board la yout is a critical portion of the total design. the footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. with the correct pad geometry, the packages will self-align when subjected to a solder reflow process. it is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. figure 5. ssop footprint (case 1317 and 1317a) 0.027 typ 8x 0.69 0.053 typ 8x 1.35 inch mm 0.387 9.83 0.150 3.81 0.050 1.27 typ
mpxh6300a sensors freescale semiconductor, inc. 7 pressure package dimensions case 1317-04 issue h super small outline package page 1 of 3
mpxh6300a sensors 8 freescale semiconductor, inc. pressure package dimensions case 1317-04 issue h super small outline package page 2 of 3
mpxh6300a sensors freescale semiconductor, inc. 9 pressure package dimensions case 1317-04 issue h super small outline package page 3 of 3
mpxh6300a sensors 10 freescale semiconductor, inc. pressure package dimensions case 1317a-04 issue d super small outline package
mpxh6300a sensors freescale semiconductor, inc. 11 pressure package dimensions case 1317a-04 issue d super small outline package
mpxh6300a sensors 12 freescale semiconductor, inc. pressure table 3. revision history revision number revision date description of changes 5.1 05/2012 ? updated package drawing 98arh99066a was rev. f, updated to rev. h.
mpxh6300a rev. 5.1 05/2012 information in this document is provided solely to enable system and software implementers to use freescale products. th ere are no express or implied copyright licenses granted hereunder to design or fabr icate any integrated circuits based on the information in this document. freescale reserves the right to make changes without further notice to any products herein. freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does freescale assume any liability arising out of the applic ation or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. all operating parameters, including ?typicals,? must be validated for each customer application by customer?s technical experts. freescale does not convey any license under its patent rights nor the rights of others. freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: http://www.reg.net/ v2/webservices/freescale/docs/termsandconditions.htm . freescale and the freescale logo are tradem arks of freescale semiconductor, inc., reg. u.s. pat. & tm. off. all other product or service names are t he property of their respective owners. ? 2012 freescale semiconductor, inc. all rights reserved. how to reach us: home page: www.freescale.com web support: http://www.freescale.com/support

▲Up To Search▲

Price & Availability of MPXH6300AC6T1

	To Download MPXH6300AC6T1 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .